Useful when you need a custom RF front-end, distribution network, detector or amplifier path.
RF, FPGA & Rugged Hardware Portfolio
Review Indra Insignia hardware for RF modules, FPGA cards, rugged power units and test jigs. These products support defence, aerospace, radar and industrial programs.
RF & Microwave Subsystem Engineering
RF and microwave designs for radar, telemetry, receiver chains, signal distribution and testing. This includes S-band and X-band needs.
Supports simulation, PCB layout, bring-up, RF tuning and subsystem validation.
Examples include amplifiers, detectors, filters, dividers, combiners and distribution units.
Design and validation capabilities
- S-band and X-band RF front-end, active-array radar and transceiver design.
- Microstrip power dividers and combiners for 24-way and custom multi-way layouts.
- Low-noise amplifier and detector module design with noise figure targets below 1.5 dB.
- Phase- and amplitude-matched RF networks with ±5° phase and ±1 dB amplitude targets.
- RF switches, filters, frequency networks, synthesizers and hybrid RF modules with simulation, layout review and validation.
Representative delivered hardware
Dual Channel RF Amplifier
Built for matched gain and phase in radar signal paths. It includes DAC, ADC, attenuator and phase-shifter interfaces.
Frequency30 ± 3 MHz
ProcessorSTM32 Controller
ComplianceMIL-STD-461E/F
Dimensions210 x 124 x 40 mm
Four Channel RF Detector & Simulator Assembly
Used for weather radar testing. It communicates over 10/100 Mbps Ethernet and connects to SSPA output channels.
FrequencyX-Band
ProcessorSTM32F767ZIT6
ComplianceMIL-STD-461E/F
Weight1.125 kg; ruggedized enclosure
S-Band Low Noise Amplifier
Dual-channel LNA block with 55 dB gain, low noise and strong harmonic rejection. Designed and validated for JSS 55555 needs.
Noise Figure< 1.5 dB
Gain / Attn55 dB / 30 dB
Max Input200 mW
ComplianceJSS 55555, Ground Equipment
Dual Channel Detector Module
Works from 10 to 400 MHz. It uses an EMI/EMC shielded aluminum enclosure, pulse trigger inputs and a D-sub interface.
Frequency10 - 400 MHz
HousingAluminum Al-6061
InterfacesSMA / D-sub
FeaturesPulse Trigger
Calibration Switch Module
Built for S-band radar calibration. It supports 32 paths with controlled amplitude and phase balance.
Channels32 port-to-port
Balance±1 dB amplitude / ±5° phase
Power Handling50 W forward/reverse
ProcessorM2S090 Core
S-Band Switched Filter Bank
Compact ceramic filter assembly for four passbands. It uses Rogers R4350B layers and an Al-6061 housing frame.
Passband Ripple< 0.5 dB
Insertion Loss6 dB Max
Interface1G Ethernet RGMII
Max Input Power30 dBm
12-Way S-Band Power Combiner
Precision 12-way S-band RF combiner for tight airborne and ground interfaces.
Frequency3.1 - 3.5 GHz
Phase Match< 5 degrees
Amp Match< 1 dB
EnvironmentAirborne / Ground
24-Way Microstrip Power Divider
Corporate-feed 24-way S-band divider for balanced RF output channels.
Frequency3.1 - 3.5 GHz (S-Band)
Isolation20 dB Min
Balance0.5 dB / ±4° phase
Temperature-40°C to +70°C
Embedded Computing & FPGA Systems
Embedded control and FPGA platforms for control, acquisition, protocol conversion and diagnostics. Designs can use Xilinx Artix-7, Zynq UltraScale+ or Microsemi FPGA devices.
Useful for radar, avionics, industrial control, diagnostics and high-speed data handling.
Supports FPGA/MCU architecture, ADC/DAC interfaces, digital buses and board-level validation.
Representative examples include display controllers, data acquisition cards and control cards.
Design and validation capabilities
- Avionics and industrial interfaces such as MIL-STD-1553B, ARINC 429, VME, Ethernet and digital buses.
- High-speed ADC/DAC interfaces, including 12- to 18-bit devices and GSPS-class acquisition.
- High-speed memory and serial interfaces such as DDR3, DDR4, DDR5, LPDDR4/5, JESD204B and PCIe.
- Firmware for processing platforms, ARM Cortex microcontrollers and real-time environments.
Representative delivered hardware
Logical Interface Unit for High Power Amplifier Control
FPGA-based LIU replacement module rebuilt for an airborne transmitter control unit. It supports high power amplifier control and form-fit-function deployment continuity.
FocusHPA control interface
PlatformMicrosemi FPGA
CompatibilityForm-fit-function replacement
OutcomeSystem-level validation support
Rugged Display Controller
Processing interface based on TI Sitara AM625. It supports dual flash boot logic and on-board JTAG debugging.
InterfacesVGA / HDMI
ComplianceEN 61326-1
RF Data Acquisition Card
Mixed-signal acquisition module with 2 GB memory and pulse-trigger control support.
StorageQSPI Flash
Net Interface1G RGMII
Ethernet-to-SPI Control Card
FPGA-based communication converter. It links radar controller commands to peripheral assemblies through isolated network interfaces.
ProcessorXilinx Artix-7
ProtocolsUDP, TCP/IP, SPI
EnclosureMilled Al-6061
Dimensions150 x 180 x 45 mm
LIU Flex PCB
Flexible PCB and compact interconnect support for tight spaces. It helps with connector alignment and reliable signal routing.
FocusFlexible interconnect
Use CaseSpace-constrained assemblies
ABCM Imaging Radar PCB
Compact 12-layer high-density board with 80 MHz ADC sampling, power routing and AVB multi-queue support.
ADC Sampling80 MHz; I2C control
Ethernet10/100 Mbps and 1G
PCB Layers12-layer / 2 mm
FeaturesAVB multi-queue
Antenna Control Card
Scalable FPGA control node for active antenna arrays and AESA layouts. It includes on-board BITE diagnostics.
ProcessorXilinx Artix-7
Memory4 GB DDR4 / 8 GB SD
Control Lines32 TTL lines
ComplianceJSS 55555, Ground Equipment
Specification-based item
ADAR - Beam Former
Compact beamforming module for antenna beam control and active radar front-end integration.
Beamforming ICsADAR4002 / ADAR1000
PCB Layers10-layer layout
Dimensions125 x 113 mm
Operating Temp-20°C to +70°C
Specification-based item
MPC574xxx Control Card
Rugged control card for vehicle, servo and military control needs. It supports monitoring, communication and control in harsh conditions.
ProcessorMPC574xxx MCU
Bus LinksEthernet, I2C, SPI
ComplianceMIL-STD-461E/F
Use CaseServo, vehicle control and radar simulation
Specification-based item
ZYNQ MPSoC Control Card
Mixed-signal processing card based on Zynq UltraScale+. It supports radar, transponder and signal-processing use cases with high-speed ADC/DAC interfaces.
ProcessorZynq UltraScale+
ADC / DAC2 GHz / 500 MHz
Avionics BusARINC 429 / MIL-STD-1553B
PCB Layout24-layer board
Rugged Electronics & Mechanical Integration
Rugged electronics, power modules and enclosures for harsh aerospace, defence and industrial environments.
Useful when electronics must survive vibration, thermal, EMI/EMC and mechanical constraints.
Supports HDI layout, mechanical packaging, protection boards and qualification support.
Representative examples include monitoring PCBs and GaN bias/protection platforms.
Design and validation capabilities
- HDI engineering with micro-vias, stacked or staggered vias, blind or buried vias and back-drilling.
- Fine-pitch BGA layout down to 0.4 mm pitch, with stack-up support up to 24+ layers.
- Signal integrity, cross-talk mapping and post-layout power integrity DC IR-drop analysis.
- Qualification support for MIL-STD-461E/F, MIL-STD-810, DO-160 and JSS 55555 requirements.
Representative delivered hardware
Bias Sequencing & Protection Card
Provides gate and drain bias sequencing for three GaN amplifier channels. It monitors key RF parameters and can trigger a latched shutdown.
FPGA EngineMicrosemi M25005
Input RailsSingle +50 V DC
TelemetryVSWR, temp, current
Pulse Enable< 100 ns protection/control
GaN Bias Card (6 Channel Platform)
FPGA-based power management for six GaN channels. Each channel has independent gate and drain bias control.
Channels6 independent paths
Input PowerDual +50 V / +28 V DC
ProtectionHardware latched
Environment-40°C to +71°C
DMON Control / Monitoring PCB
Thin monitoring PCB for tight spaces. It uses a Rogers/FR-4 stack-up, fine trace spacing and controlled routing.
Base MaterialsRogers + FR4 layers
Surface FinishENIG
Trace Spacing0.25 mm minimum
Thickness0.325 mm thin
Test Jig & Automated Validation Systems
Custom test jigs, RF fixtures and bed-of-nails systems for PCB bring-up, RF testing, diagnostics and production screening.
Useful when boards or RF assemblies need faster bring-up, screening or production checks.
Supports bed-of-nails, RF test fixtures, calibration scripts and interface validation.
Representative examples include RF test jigs, NFTR jigs, AAAU jigs and CSM Test jig systems.
Operational processes and evaluation frameworks
- Custom acrylic and precision aluminum bed-of-nails fixtures matched to the PCB footprint.
- Durable pogo-pin layouts for fine-pitch, multi-layer interconnect checks.
- Automated calibration scripts and diagnostic sweeps for telemetry and RF responses up to 3.5 GHz.
- Transient and over-current protection during low-power and mixed-voltage board bring-up.
Delivered system infrastructure and fixture assemblies
Wireless Communication Board - RF Test Jig
Automates active antenna testing and NFTR diagnostics for naval and aerospace use.
ProcessorXilinx Artix-7
Power Link50 V input supply
I/O InterfacesLVDS, RS-422, UART
ComplianceJSS 55555, Ground Equipment
TSFM Simulator & NFTR Test Jig
Diagnostic module for waveform checks, trigger mapping and interface testing up to 3.5 GHz.
ArchitectureXilinx Artix-7
Comm Rate1 Gbps Ethernet
Testing BoundsRS232, RS422, LVDS
FeaturesIsolated NFTR port
AAAU Test Jig Assembly
Configurable validation jig for active antenna arrays and digital bus checks.
ProcessorAMD / Xilinx FPGA
Bus InterfacesRS485, RS232, LVTTL
Network Rate10/100 Mbps link
ComplianceMIL-STD-461E/F
RFTO Test Jig
Built for high-frequency checks, RF trace tuning and multi-band impedance matching. It uses low-loss coaxial signal paths.
FrequencyUp to 18 GHz
ShieldingBetter than 60 dB isolation
RF InterfaceBlind-mate SMP
Impedance50 Ω coaxial
CSM Test Jig
Built for dense multi-rail power checks. It uses durable pogo pins and transient-isolated switching protection.
Logic Channels128 matrix nodes
Switching SpeedSub-µs isolation
Voltage RailsQuad-rail tracking
Bus LinksCAN, SPI, RS-422
DC Power Distribution Box
Rugged DC power unit for vehicle systems. It supports multi-channel power and remote monitoring over RS-422 links.
Max PowerUp to 1.7 kW
Converter16-port RS-422
Dimensions565 x 350 x 221.5 mm
Op Temp55 ± 5°C
How to Shortlist the Right Hardware Reference
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Compare key specs
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Move to service scope
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Product Review Questions
Use these answers before a product discussion. They cover customization, review inputs, specs and enquiries.
These items are delivered or developed hardware references. Final availability, configuration, documents and customization are reviewed against your requirement.
Yes. Products can be adapted by frequency range, interface type, enclosure, power rating, firmware logic, compliance need and test flow when feasible.
Share target specs, operating conditions, interfaces, mechanical limits, standards, quantity and any drawings, documents or existing hardware details.
Yes. Work can include board bring-up, RF validation, functional tests, environmental review, test-jig support and production-ready documents.
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